3DeVOK MQ 3D Color Scanner - High-Precision Full-Color 3D Scanning
Capture ultra-accurate geometry and realistic color textures with the advanced 3DeVOK MQ 3D Color Scanner, built for engineering, inspection, reverse engineering, and digital archiving.
Trusted by Engineering Firms, R&D Labs, Automotive & Industrial Manufacturers Across India
3DeVOK MQ Empowers Professionals Transforming Everyone into a 3D Creator
Experience next-generation scanning with the 22-Line Infrared Laser + Infrared Speckle Technology, combined with a dual Field of View (FoV) for unmatched precision and speed.
With one scanner, unlock endless possibilities ideal for 3D printing, cultural heritage preservation, reverse engineering, product design, art, medical rehabilitation, and academic research.
The 3DeVOK MQ is the ultimate 3D productivity partner, perfectly suited for 3D printing farms, design studios, and small to medium-sized businesses seeking efficiency and accuracy.
Key Features of 3DeVOK MQ 3D Color Scanner
Fast, non-contact, high-resolution 3D scanning solutions trusted by automotive, aerospace, manufacturing, and R&D industries.
Accurate
Up to 0.08mm accuracy for highly detailed scans
Detailed
0.1mm resolution captures even the finest details
Fast
4.5 million points per second for professional efficiency
Marker-free
Infrared laser and speckle enable non-marker scanning
Color-Accurate
24-bit color + texture mapping for true-to-life colors
Wireless
Optional wireless handle for easy large-object scanning
Optimized Hardware for High-Definition 3D Scanning
Precision-Engineered Sensors and Optics for High-Accuracy 3D Scanning
3DeVOK MQ Technical Specifications
| Specification | Infrared Laser Lines (22) - Invisible | Infrared VCSEL Structured Light (Speckle) - Invisible |
|---|---|---|
| Class of Lasers | Class I (Eye-safe) | |
| Scan Modes | Infrared laser lines - supports markerless and invisible-light scanning. | Infrared linear-array structured light (speckle) - supports markerless scanning, invisible-light scanning, partial fine scanning, and rapid scanning at ultra-long distance with ultra-large FoV. |
| Accuracy | Up to 0.08 mm | |
| Point Distance | 0.1–5 mm | |
| Alignment Mode | Hybrid, markers, texture, and geometric features alignment. | Hybrid, texture, and geometric features alignment. |
| Ability to Capture Texture | Yes | |
| Scanning Distance | 150–1,000 mm | 150–1,500 mm |
| Field of View | 140 × 140 mm – 490 × 490 mm | 50 × 75 mm – 1,100 × 1,000 mm |
| Scanning Frame | Up to 80 FPS (marker alignment) | Up to 30 FPS |
| Scanning Speed | Up to 2,450,000 points/s | Up to 4,500,000 points/s |
| Output Formats | *.obj, *.stl, *.ply, *.asc, *.mk2, *.txt, *.epi, *.api, *.spi, *.map, *.sk | |
| 3D Printing Compatibility | Supports .stl, .obj and other common formats | |
| Wireless Scanning | Supported (with optional handle) | |
| Working Temperature | 0 – 40 °C | |
| Working Humidity | 10% – 90% RH (non-condensing) | |
| Interface | USB 3.0 | |
| Scanner Size & Weight | 215 mm × 73 mm × 53 mm; Weight: 550 g | |
| Power Source | DC 12 V, 5.0 A | |
| Certifications | CE-EMC, FCC, RoHS, IEC 60825, IEC 62471, IEC 60529-IP50, WEEE, KC | |
| Recommended PC Configuration | OS: Windows 10/11 (64-bit); CPU: Intel i7-13650HX or above; RAM: 32 GB+; GPU: NVIDIA discrete graphics (RTX 3060 or above); Graphics memory: 6 GB+. | |
What Is In The Box
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